Siemens Brings Advanced Multiphysics And AI To Chip Design

Siemens enhanced Calibre with multiphysics simulation for 3D IC thermal analysis, a current gap in 3D IC design verification.

Jun 25, 2024 - 20:30
 0  4
Siemens Brings Advanced Multiphysics And AI To Chip Design
Siemens enhanced Calibre with multiphysics simulation for 3D IC thermal analysis, a current gap in 3D IC design verification.

What's Your Reaction?

like

dislike

love

funny

angry

sad

wow